PART |
Description |
Maker |
DB2460200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
DB2141200L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB2430500L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB2440100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
GRM32ER61C226ME20L GRM32ER61C226ME20K |
φ180, 330mm Embossed taping
|
Murata Manufacturing Co., Ltd.
|
HMK316AC7225ML-TE |
Standard packaging quantity (minimum) Taping Embossed 2000pcs
|
Taiyo Yuden (U.S.A.), I...
|
87985-8030 |
2.00mm (.079) Pitch Milli-Grid IDT Receptacle, Dual Row, with Center Polarization Key and Embossed Metal Latch, 30 Circuits
|
Molex Electronics Ltd.
|
0791098603 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, with Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
0791098414 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
0791098452 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|